SMT -klæbende binding
May 27, 2025
Electrically conductive adhesives (Ag-epoxy) replace solder in flexible circuits. Dispensing accuracy: 0.1mm dot size. Cure parameters: UV (5s) or thermal (150°C/30min). Applications: MEMS, display bonding. Shear strength >25MPa pr. ASTM D 1002. Udfordringer: Langsigtet ledningsevne stabilitet under fugtighed .
Et par af: Blyfrie reflow-profil tip
Næste: SMT Warpage Control
