SMT termisk profilering

Refow -profilering kræver 4- faseoptimering: forvarmning (1-3 grad /s), blødgøring (60-120 s ved 150-180 grad), reflow (30-60 s over 217 grad), afkøling (afkøling (<6°C/s). KIC thermal profilers use predictive algorithms for complex boards. Thermocouples attach to thermal mass areas for accuracy. Nitrogen environments permit 10°C lower peak temperatures. Ramp-to-spike profiles reduce tombstoning. DOE methods correlate profile settings with shear strength. Standards: IPC-7531 guidelines for profile validation.